Invention Grant
- Patent Title: Method for fabricating a semiconductor device and semiconductor package
- Patent Title (中): 半导体器件和半导体封装的制造方法
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Application No.: US13909727Application Date: 2013-06-04
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Publication No.: US08728869B2Publication Date: 2014-05-20
- Inventor: Gottfried Beer , Irmgard Escher-Poeppel
- Applicant: Intel Mobile Communications GmbH
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakey, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method for fabricating a semiconductor chip module and a semiconductor chip package is disclosed. One embodiment provides a first layer, a second layer, and a base layer. The first layer is disposed on the base layer, and the second layer is disposed on the first layer. A plurality of semiconductor chips is applied above the second layer, and the second layer with the applied semiconductor chips is separated from the first layer.
Public/Granted literature
- US20130267063A1 METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE Public/Granted day:2013-10-10
Information query
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