Invention Grant
US08728873B2 Methods for filling a contact hole in a chip package arrangement and chip package arrangements
有权
填充芯片封装结构中的接触孔和芯片封装结构的方法
- Patent Title: Methods for filling a contact hole in a chip package arrangement and chip package arrangements
- Patent Title (中): 填充芯片封装结构中的接触孔和芯片封装结构的方法
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Application No.: US12879069Application Date: 2010-09-10
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Publication No.: US08728873B2Publication Date: 2014-05-20
- Inventor: Benjamin Alles , Joachim Mahler , Edward Fuergut , Ivan Nikitin
- Applicant: Benjamin Alles , Joachim Mahler , Edward Fuergut , Ivan Nikitin
- Applicant Address: DE Neubierg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubierg
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L21/50
Abstract:
In various embodiments, a method for filling a contact hole in a chip package arrangement is provided. The method may include introducing electrically conductive discrete particles into a contact hole of a chip package; and forming an electrical contact between the electrically conductive particles and a contact terminal of the front side and/or the back side of the chip.
Public/Granted literature
- US20120061845A1 Methods for filling a contact hole in a chip package arrangement and chip package arrangements Public/Granted day:2012-03-15
Information query
IPC分类:
