Invention Grant
- Patent Title: Method for manufacturing silicon carbide semiconductor device with a single crystal substrate
- Patent Title (中): 具有单晶基板的碳化硅半导体器件的制造方法
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Application No.: US13687883Application Date: 2012-11-28
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Publication No.: US08728877B2Publication Date: 2014-05-20
- Inventor: Keiji Wada , Takeyoshi Masuda
- Applicant: Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; Tamatane J. Aga
- Priority: JP2011-290203 20111229
- Main IPC: H01L21/332
- IPC: H01L21/332 ; H01L21/30 ; H01L21/46 ; H01L29/15

Abstract:
On a single-crystal substrate, a drift layer is formed. The drift layer has a first surface facing the single-crystal substrate, and a second surface opposite to the first surface, is made of silicon carbide, and has first conductivity type. On the second surface of the drift layer, a collector layer made of silicon carbide and having second conductivity type is formed. By removing the single-crystal substrate, the first surface of the drift layer is exposed. A body region and an emitter region are formed. The body region is disposed in the first surface of the drift layer, and has the second conductivity type different from the first conductivity type. The emitter region is disposed on the body region, is separated from the drift layer by the body region, and has first conductivity type.
Public/Granted literature
- US20130171778A1 METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2013-07-04
Information query
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