Invention Grant
US08728908B2 Methods of forming a dielectric cap layer on a metal gate structure 有权
在金属栅极结构上形成电介质盖层的方法

Methods of forming a dielectric cap layer on a metal gate structure
Abstract:
Disclosed herein are various methods of forming metal-containing insulating material regions on a metal layer of a gate structure of a semiconductor device. In one example, the method includes forming a gate structure of a transistor, the gate structure comprising at least a first metal layer, and forming a first metal-containing insulating material region in the first metal layer by performing a gas cluster ion beam process using to implant gas molecules into the first metal layer.
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