Invention Grant
US08728908B2 Methods of forming a dielectric cap layer on a metal gate structure
有权
在金属栅极结构上形成电介质盖层的方法
- Patent Title: Methods of forming a dielectric cap layer on a metal gate structure
- Patent Title (中): 在金属栅极结构上形成电介质盖层的方法
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Application No.: US13205050Application Date: 2011-08-08
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Publication No.: US08728908B2Publication Date: 2014-05-20
- Inventor: Ruilong Xie , Chang Seo Park , William James Taylor, III , John Iacoponi
- Applicant: Ruilong Xie , Chang Seo Park , William James Taylor, III , John Iacoponi
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Amerson Law Firm, PLLC
- Main IPC: H01L21/76
- IPC: H01L21/76

Abstract:
Disclosed herein are various methods of forming metal-containing insulating material regions on a metal layer of a gate structure of a semiconductor device. In one example, the method includes forming a gate structure of a transistor, the gate structure comprising at least a first metal layer, and forming a first metal-containing insulating material region in the first metal layer by performing a gas cluster ion beam process using to implant gas molecules into the first metal layer.
Public/Granted literature
- US20130040450A1 Methods of Forming a Dielectric Cap Layer on a Metal Gate Structure Public/Granted day:2013-02-14
Information query
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