Invention Grant
- Patent Title: Method for forming the semiconductor cell
- Patent Title (中): 半导体电池的形成方法
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Application No.: US13210654Application Date: 2011-08-16
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Publication No.: US08728909B2Publication Date: 2014-05-20
- Inventor: Kyung Do Kim
- Applicant: Kyung Do Kim
- Applicant Address: KR Icheon
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Icheon
- Priority: KR10-2011-0044738 20110512
- Main IPC: H01L21/76
- IPC: H01L21/76

Abstract:
A semiconductor cell includes first trenches defining fin type active regions within the semiconductor substrate and adjacent to each other, second trenches disposed at one side and the other side of the first trenches, adjacent to the first trench and including fin type active regions, a first oxide layer formed on each of surfaces of the first trenches, and a second oxide layer formed on each of surfaces of the second trenches and having a thicker thickness than the first oxide layer. Although the critical dimension of the fin is increased, the gate drivability can be improved.
Public/Granted literature
- US20120289024A1 METHOD FOR FORMING THE SEMICONDUCTOR CELL Public/Granted day:2012-11-15
Information query
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