Invention Grant
- Patent Title: Memory arrays and methods of forming same
- Patent Title (中): 存储阵列及其形成方法
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Application No.: US13358882Application Date: 2012-01-26
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Publication No.: US08728940B2Publication Date: 2014-05-20
- Inventor: Fabio Pellizzer , Antonino Rigano
- Applicant: Fabio Pellizzer , Antonino Rigano
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: H01L21/302
- IPC: H01L21/302

Abstract:
Memory arrays and methods of forming the same are provided. One example method of forming a memory array can include forming a first conductive material having a looped feature using a self-aligning multiple patterning technique, and forming a first sealing material over the looped feature. A first chop mask material is formed over the first sealing material. The looped feature and the first sealing material are removed outside the first chop mask material.
Public/Granted literature
- US20130193398A1 MEMORY ARRAYS AND METHODS OF FORMING SAME Public/Granted day:2013-08-01
Information query
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