Invention Grant
US08729148B2 Photocurable dry film, method for preparing same, patterning method and film for protecting electric and electronic parts
有权
可光固化干膜,其制备方法,图案化方法和保护电气和电子部件的膜
- Patent Title: Photocurable dry film, method for preparing same, patterning method and film for protecting electric and electronic parts
- Patent Title (中): 可光固化干膜,其制备方法,图案化方法和保护电气和电子部件的膜
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Application No.: US12967163Application Date: 2010-12-14
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Publication No.: US08729148B2Publication Date: 2014-05-20
- Inventor: Satoshi Asai , Takanobu Takeda , Hideto Kato
- Applicant: Satoshi Asai , Takanobu Takeda , Hideto Kato
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: C08J3/28
- IPC: C08J3/28 ; C08F2/50 ; G03F7/00 ; G03F7/004 ; G03C1/73 ; C09D183/14 ; H01L23/29

Abstract:
Disclosed herein is a photocurable dry film including a structure having a photocurable resin layer sandwiched between a support film and a protective film, the photocurable resin layer being formed of a photocurable resin composition including ingredients (A) to (D):(A) a silicone skeleton-containing polymer compound having the repeating units represented by the following general formula (1) wherein X and Y, respectively, a divalent organic group represented by the following general formula (2) or (3) (B) a crosslinking agent selected from formalin-modified or formalin-alcohol-modified amino condensates and phenolic compound having on average two or more methylol groups or alkoxymethylol groups in one molecule; (C) a photoacid generator capable of generating an acid by decomposition with light having a wavelength of 190 to 500 nm; and (D) a solvent.
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