Invention Grant
- Patent Title: Epoxy structural adhesive
- Patent Title (中): 环氧结构胶
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Application No.: US13814794Application Date: 2011-07-19
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Publication No.: US08729197B2Publication Date: 2014-05-20
- Inventor: Michael A. Kropp
- Applicant: Michael A. Kropp
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent Dena M. Ehrich
- International Application: PCT/US2011/044414 WO 20110719
- International Announcement: WO2012/021258 WO 20120216
- Main IPC: B65B3/00
- IPC: B65B3/00 ; C08L63/00 ; C08L63/02 ; C08L63/04

Abstract:
Room temperature curing epoxy adhesives that show good adhesion to plastic substrates are described. The adhesives contain an epoxy resin component comprising a first epoxy resin and a second epoxy resin; a first amine curing agent having an equivalent weight of at least 50 grams per mole of amine equivalents; a second amine curing agent having an equivalent weight of no greater than 45 grams per mole of amine equivalents; an acetoacetoxy-functionalized compound; a metal salt catalyst; and a multifunctional acrylate.
Public/Granted literature
- US20130137796A1 Epoxy Adhesive Public/Granted day:2013-05-30
Information query