A wire bonding joint structure of a joint pad in which electroless surface treatment plating layers of joint pads configured by a nickel layer/a palladium layer/a gold layer are connected to each other by a metal wire and when the metal wire is joined to the electroless surface treatment plating layer, a depth of the wire bonding pad formed by wedge deformation is 1.0 m or more.The electroless surface treatment layer of the joint pad can lower strength and hardness of the wire bonding pad of which the surface is treated to improve follow-up capability between a gold wire and the bonding pad, such that a joint area between the gold and the bonding pad is maximized, thereby increasing joinability at the wire bonding finish process by wedge pressure and greatly improving wire bonding workability.