Invention Grant
- Patent Title: Wiring substrate and method of manufacturing the same
- Patent Title (中): 接线基板及其制造方法
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Application No.: US13032071Application Date: 2011-02-22
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Publication No.: US08729401B2Publication Date: 2014-05-20
- Inventor: Tomoo Yamasaki , Michio Horiuchi
- Applicant: Tomoo Yamasaki , Michio Horiuchi
- Applicant Address: JP Nagano-Shi
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-Shi
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2010-054149 20100311
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/16 ; H05K1/11
Abstract:
A wiring substrate includes a composite substrate including an oxidized aluminum substrate portion in which a large number of penetration conductors penetrating in a thickness direction are provided, and a frame-like aluminum substrate portion provided around the oxidized aluminum substrate portion, and a wiring layer of n layers (n is an integer of 1 or more) connected to the penetration conductors.
Public/Granted literature
- US20110220404A1 WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-09-15
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