Invention Grant
- Patent Title: Moulding to conceal wiring
- Patent Title (中): 成型隐蔽接线
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Application No.: US12913926Application Date: 2010-10-28
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Publication No.: US08729408B2Publication Date: 2014-05-20
- Inventor: Dennis J. Pawlak
- Applicant: Dennis J. Pawlak
- Agent Charles McCloskey
- Main IPC: H02G3/08
- IPC: H02G3/08 ; F16L3/22 ; E04C2/52

Abstract:
Moulding to conceal wiring has at least one piece, a cavity within the piece and a resilient flap for the cavity. The cavity and the flap extend for the length of the moulding. The moulding has a major piece that receives a minor piece. The major piece has a top portion upon a stem above a base portion. The top portion has a contour of architectural form. The top portion has cladding over it and nearly half way down the stem. The base portion has a keyway for the minor portion. The minor piece has a tongue with cladding upon it and that extends for half of the cavity. The cladding of the top portion has a free end that extends inside of the tongue. The free end deflects into the cavity for wire insertion but resiliently closes against the tongue. Alternatively, the invention has single piece construction.
Public/Granted literature
- US20110108318A1 MOULDING TO CONCEAL WIRING Public/Granted day:2011-05-12
Information query
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