Invention Grant
- Patent Title: Thermal cutting machine and thermal cutting method
- Patent Title (中): 热切割机和热切割方法
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Application No.: US11629283Application Date: 2005-06-02
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Publication No.: US08729421B2Publication Date: 2014-05-20
- Inventor: Satoshi Ohnishi , Yoshihiro Yamaguchi
- Applicant: Satoshi Ohnishi , Yoshihiro Yamaguchi
- Applicant Address: JP Komatsu-Shi
- Assignee: Komatsu Industries Corporation
- Current Assignee: Komatsu Industries Corporation
- Current Assignee Address: JP Komatsu-Shi
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2004-177819 20040616
- International Application: PCT/JP2005/010111 WO 20050602
- International Announcement: WO2005/123327 WO 20051229
- Main IPC: B23K9/02
- IPC: B23K9/02

Abstract:
A lattice pallet 13 having a large number of supporters for placing a plate 14 is installed to a table 12 so as to be freely fittable and removable. Bringing in of the plate 14 is performed by the method of raising the lattice pallet 13 with a crane with the plate 14 already having been loaded upon the lattice pallet 13 in a different location, transporting them over the table 12, and lowering them down onto the table 12. Directly after cutting has been completed, the lattice pallet 12 is raised and separated from the table 12 with the manufactured product and the left over material carried upon it and is taken away to a different location, and another lattice pallet 13 with another plate 14 mounted upon it is brought in with the crane upon the table 12, and the task of cutting this other plate 14 is commenced.
Public/Granted literature
- US20080029489A1 Thermal Cutting Machine And Thermal Cutting Method Public/Granted day:2008-02-07
Information query
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