Invention Grant
- Patent Title: Cover, a container assembly including the cover, a molding device for molding the cover and a method for manufacturing the cover
- Patent Title (中): 盖，包括盖的容器组件，用于模制盖的模制装置和用于制造盖的方法
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Application No.: US12384975Application Date: 2009-04-10
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Publication No.: US08729438B2Publication Date: 2014-05-20
- Inventor: Yoshihisa Iwasaki
- Applicant: Yoshihisa Iwasaki
- Applicant Address: JP Yamato-Koriyama, Nara
- Assignee: Iwasaki Industry, Inc.
- Current Assignee: Iwasaki Industry, Inc.
- Current Assignee Address: JP Yamato-Koriyama, Nara
- Agency: Henneman & Associates, PLC
- Agent Larry E. Henneman, Jr.; Gregory P. Gibson
- Priority: JP2006-280237 20061013
- Main IPC: H05B6/80
- IPC: H05B6/80 ; B65D51/18
Abstract:
A cover for covering an opening of a container for a food stuff includes a substantially flat cover body including at least one aperture and at least one substantially flat flap. The at least one flap includes a linear proximal end configured to connect with the cover body and allow the at least one flap to rotate with respect to the cover body. A lower surface of the at least one flap includes a protrusion configured to close the at least one aperture when the at least one flap is at a first position in which the at least one flap is in parallel with the cover body. The cover body and the at least one flap are integrally formed by a co-injection molding. The container and cover are suitable for heating a food stuff in a microwave.
Public/Granted literature
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