Invention Grant
US08729563B2 Solid state lighting devices with selected thermal expansion and/or surface characteristics, and associated methods 有权
具有选定热膨胀和/或表面特性的固态照明装置及相关方法

  • Patent Title: Solid state lighting devices with selected thermal expansion and/or surface characteristics, and associated methods
  • Patent Title (中): 具有选定热膨胀和/或表面特性的固态照明装置及相关方法
  • Application No.: US13617846
    Application Date: 2012-09-14
  • Publication No.: US08729563B2
    Publication Date: 2014-05-20
  • Inventor: Ji-Soo Park
  • Applicant: Ji-Soo Park
  • Applicant Address: US ID Boise
  • Assignee: Micron Technology, Inc.
  • Current Assignee: Micron Technology, Inc.
  • Current Assignee Address: US ID Boise
  • Agency: Perkins Coie LLP
  • Main IPC: H01L33/32
  • IPC: H01L33/32
Solid state lighting devices with selected thermal expansion and/or surface characteristics, and associated methods
Abstract:
Solid state lighting (SSL) devices and methods are disclosed. A particular method includes forming an SSL formation structure having a CTE, selecting a first material of an interlayer structure to have a first material CTE greater than the substrate CTE, and selecting a second material based at least in part on the second material having a CTE less than the first material CTE. The intelayer structure is formed over the SSL formation structure e.g., with a first layer of the first material over the SSL formation structure, a portion of the second material over the first material, and a second layer of the first material over the second material. The CTE difference between the first and second materials can counteract a force placed on the formation structure by the first material. Particular formation structures can have an off-cut angle with a non-zero value of up to about 4.5 degrees.
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