Invention Grant
- Patent Title: Integrated die-level cameras and methods of manufacturing the same
- Patent Title (中): 集成模具级相机及其制造方法
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Application No.: US13281674Application Date: 2011-10-26
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Publication No.: US08729653B2Publication Date: 2014-05-20
- Inventor: Dennis Gallagher , Adam Greengard , Paulo E. X. Silveira , Chris Linnen , Vladislav Chumachenko , Jungwon Aldinger
- Applicant: Dennis Gallagher , Adam Greengard , Paulo E. X. Silveira , Chris Linnen , Vladislav Chumachenko , Jungwon Aldinger
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lathrop & Gage LLP
- Main IPC: H01L31/0232
- IPC: H01L31/0232
Abstract:
An integrated die-level camera system and method of making the camera system include a first die-level camera formed at least partially in a die. A second die level camera is also formed at least partially in the die. Baffling is formed to block stray light between the first and second die-level cameras.
Public/Granted literature
- US20130105925A1 Integrated Die-Level Cameras And Methods Of Manufacturing The Same Public/Granted day:2013-05-02
Information query
IPC分类:
