Invention Grant
- Patent Title: MEMS integrated chip with cross-area interconnection
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Application No.: US13214709Application Date: 2011-08-22
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Publication No.: US08729660B2Publication Date: 2014-05-20
- Inventor: Hsin-Hui Hsu , Chuan-Wei Wang , Sheng-Ta Lee
- Applicant: Hsin-Hui Hsu , Chuan-Wei Wang , Sheng-Ta Lee
- Applicant Address: TW Hsin-Chu
- Assignee: Pixart Imaging Inc.
- Current Assignee: Pixart Imaging Inc.
- Current Assignee Address: TW Hsin-Chu
- Agency: Tung & Associates
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L29/84
Abstract:
The present invention discloses a MEMS (Micro-Electro-Mechanical System) integrated chip with cross-area interconnection, comprising: a substrate; a MEMS device area on the substrate; a microelectronic device area on the substrate; a guard ring separating the MEMS device area and the microelectronic device area; and a conductive layer on the surface of the substrate below the guard ring, or a well in the substrate below the guard ring, as a cross-area interconnection electrically connecting the MEMS device area and the microelectronic device area.
Public/Granted literature
- US20110298136A1 MEMS INTEGRATED CHIP WITH CROSS-AREA INTERCONNECTION Public/Granted day:2011-12-08
Information query
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