Invention Grant
- Patent Title: Package structure and LED package structure
- Patent Title (中): 封装结构和LED封装结构
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Application No.: US12889875Application Date: 2010-09-24
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Publication No.: US08729681B2Publication Date: 2014-05-20
- Inventor: Chen-Hsiu Lin , Chih-Chiang Kao
- Applicant: Chen-Hsiu Lin , Chih-Chiang Kao
- Applicant Address: CN Guanghou TW Taipei
- Assignee: Lite-On Electronics (Guangzhou) Limited,Lite-On Technology Corporation
- Current Assignee: Lite-On Electronics (Guangzhou) Limited,Lite-On Technology Corporation
- Current Assignee Address: CN Guanghou TW Taipei
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: CN201010000789 20100120
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A package structure includes a base unit, a pin unit and a housing unit. The base unit has a carrier member and a through hole penetrating through the carrier member, and at least one annular structure is formed in the through hole. The pin unit has a plurality of conductive pins disposed beside the carrier member. The housing unit has an annular housing encircling the carrier member to envelop one part thereof and connecting to the pin unit, and the annular housing is partially filled into the through hole to cover the annular structure. Therefore, the instant disclosure can increase the bonding force between the carrier member and the annular housing and retard external moisture to permeate through slits between the carrier member and the annular housing to intrude into the chip-mounting region, thus the reliability and the usage life are increased.
Public/Granted literature
- US20110175134A1 PACKAGE STRUCTURE AND LED PACKAGE STRUCTURE Public/Granted day:2011-07-21
Information query
IPC分类:
