Invention Grant
- Patent Title: Interposer chip, multi-chip package including the interposer chip, and method of manufacturing the same
- Patent Title (中): 内插芯片，包括插入片芯片的多芯片封装及其制造方法
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Application No.: US13215425Application Date: 2011-08-23
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Publication No.: US08729684B2Publication Date: 2014-05-20
- Inventor: Yeong-Lyeol Park , Sung-Dong Cho , Sin-Woo Kang
- Applicant: Yeong-Lyeol Park , Sung-Dong Cho , Sin-Woo Kang
- Applicant Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Consulting, PLLC
- Priority: KR10-2010-0081902 20100824
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
An interposer chip may include a substrate, a plurality of upper terminals, a plurality of lower terminals, a first conductive pattern that electrically connects the first upper terminal to a first set of one or more lower terminals, a second conductive pattern that electrically connects the second upper terminal to a second set of one or more lower terminals and a cut test pattern disposed between the first conductive pattern and the second conductive pattern, the test pattern used for testing electrical characteristics of the first conductive pattern and the second conductive pattern.
Public/Granted literature
- US20120051019A1 INTERPOSER CHIP, MULTI-CHIP PACKAGE INCLUDING THE INTERPOSER CHIP, AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2012-03-01
Information query
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