Invention Grant
US08729697B2 Sensor arrangement, a measurement circuit, chip-packages and a method for forming a sensor arrangement
有权
传感器布置，测量电路，芯片封装和形成传感器装置的方法
- Patent Title: Sensor arrangement, a measurement circuit, chip-packages and a method for forming a sensor arrangement
- Patent Title (中): 传感器布置，测量电路，芯片封装和形成传感器装置的方法
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Application No.: US13345865Application Date: 2012-01-09
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Publication No.: US08729697B2Publication Date: 2014-05-20
- Inventor: Horst Theuss , Klaus Elian
- Applicant: Horst Theuss , Klaus Elian
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L21/04
- IPC: H01L21/04
Abstract:
A sensor arrangement is provided, the sensor arrangement including a chip including a sensor circuit configured to detect a bending of the chip; and a package structure configured to protect the chip; wherein the package structure includes a first region and a second region, and wherein the package structure is configured such that it is easier to be deformed in the first region than in the second region.
Public/Granted literature
- US20130175527A1 SENSOR ARRANGEMENT, A MEASUREMENT CIRCUIT, CHIP-PACKAGES AND A METHOD FOR FORMING A SENSOR ARRANGEMENT Public/Granted day:2013-07-11
Information query
IPC分类:
