Invention Grant
- Patent Title: Epoxy resin composition for semiconductor encapsulation
- Patent Title (中): 用于半导体封装的环氧树脂组合物
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Application No.: US13556646Application Date: 2012-07-24
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Publication No.: US08729715B2Publication Date: 2014-05-20
- Inventor: Tomohito Iwashige , Tomoaki Ichikawa , Mitsuaki Fusumada , Naoya Sugimoto
- Applicant: Tomohito Iwashige , Tomoaki Ichikawa , Mitsuaki Fusumada , Naoya Sugimoto
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-162305 20110725
- Main IPC: H01L23/29
- IPC: H01L23/29
Abstract:
The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following components (A) to (D): (A) an epoxy resin; (B) a phenol resin; (C) an inorganic filler, and (D) a silicone compound containing an alkoxy group directly bonded to silicon atom in an amount of 10 to 45 wt % based on the entire silicone compound and having a specific gravity of 1.10 to 1.30.
Public/Granted literature
- US20130026662A1 EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE USING THE SAME Public/Granted day:2013-01-31
Information query
IPC分类:
