Invention Grant
- Patent Title: Composite substrate manufacturing method and composite substrate
- Patent Title (中): 复合基板制造方法和复合基板
-
Application No.: US13253156Application Date: 2011-10-05
-
Publication No.: US08729771B2Publication Date: 2014-05-20
- Inventor: Hiroki Kobayashi , Takanori Sakurai , Yuji Hori , Yasunori Iwasaki
- Applicant: Hiroki Kobayashi , Takanori Sakurai , Yuji Hori , Yasunori Iwasaki
- Applicant Address: JP Aichi-prefecture
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Aichi-prefecture
- Agency: Cermak Nakajima LLP
- Agent Tomoko Nakajima
- Main IPC: H03H9/05
- IPC: H03H9/05 ; H03H9/02

Abstract:
According to a composite substrate manufacturing method of the present invention, (a) a piezoelectric substrate having minute asperities formed in a rear surface thereof, and a support substrate having a smaller thermal expansion coefficient than the piezoelectric substrate are prepared, (b) a filler is applied to the rear surface 11a to fill the minute asperities, thereby forming a filling layer, (c) a surface of the filling layer is mirror-polished to such an extent that an arithmetic mean roughness Ra of the surface of the filling layer is smaller than an arithmetic mean roughness Ra of the rear surface 11a in a state of above (a), and (d) the surface of the filling layer and a surface of the support substrate are bonded to each other with an adhesive layer interposed therebetween, thereby forming a composite substrate.
Public/Granted literature
- US20120086312A1 COMPOSITE SUBSTRATE MANUFACTURING METHOD AND COMPOSITE SUBSTRATE Public/Granted day:2012-04-12
Information query