The invention discloses a method of fabricating a capacitance touch panel module. The method includes providing a substrate with a touching area and a peripheral area; forming a plurality of first conductive patterns on the substrate along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covers one connecting portion; forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.