Invention Grant
- Patent Title: Thermal head manufacturing method, thermal head, and printer
- Patent Title (中): 热敏头制造方法,热敏打印头和打印机
-
Application No.: US13919196Application Date: 2013-06-17
-
Publication No.: US08730286B2Publication Date: 2014-05-20
- Inventor: Keitaro Koroishi , Norimitsu Sanbongi , Toshimitsu Morooka
- Applicant: Seiko Instruments Inc.
- Applicant Address: JP Chiba
- Assignee: Seiko Instruments Inc.
- Current Assignee: Seiko Instruments Inc.
- Current Assignee Address: JP Chiba
- Agency: Brinks Gilson & Lione
- Priority: JP2012-137797 20120619
- Main IPC: B41J2/335
- IPC: B41J2/335

Abstract:
A method of manufacturing a thermal head, including: forming a concave being, which is open on one surface of a support-substrate made of an alumina material; forming an intermediate-layer made of a glass paste by printing the glass paste made of a first-glass-material on the one surface of the support-substrate and baking the glass paste; bonding an upper-substrate to the one surface of the support-substrate by arranging the upper-substrate on the intermediate-layer formed on the one surface of the support-substrate in a laminated state and heating the upper-substrate at a temperature of an annealing point thereof or higher and a softening point thereof or lower, the upper-substrate being made of a second-glass-material having a softening point lower than a softening point of the first-glass-material; and forming a heat generating resistor on a surface of the upper-substrate bonded to the support-substrate at a position opposed to the concave portion.
Public/Granted literature
- US20130335499A1 THERMAL HEAD MANUFACTURING METHOD, THERMAL HEAD, AND PRINTER Public/Granted day:2013-12-19
Information query
IPC分类: