A semiconductor die includes a substrate comprising a first layer of a first wide band gap semiconductor material having a first conductivity, a second layer of a second wide band gap semiconductor material having a second conductivity different from the first conductivity, in electrical contact with the first layer, a third layer of a third wide band gap semiconductor material having a third conductivity different from the first conductivity and second conductivity, in electrical contact with the second layer, a fourth layer of a fourth wide band gap semiconductor material having the second conductivity, in electrical contact with the third layer, and a fifth layer of a fifth wide band gap semiconductor material having the first conductivity and in electrical contact with the fourth layer, wherein the first layer, the second layer, the third layer, the fourth layer, and the fifth layer are sequentially arranged to form a structure.