Invention Grant
- Patent Title: Fluid-cooled module for integrated circuit devices
- Patent Title (中): 用于集成电路器件的流体冷却模块
-
Application No.: US13354531Application Date: 2012-01-20
-
Publication No.: US08730673B2Publication Date: 2014-05-20
- Inventor: David L. Vos
- Applicant: David L. Vos
- Applicant Address: US MD Bethesda
- Assignee: Lockheed Martin Corporation
- Current Assignee: Lockheed Martin Corporation
- Current Assignee Address: US MD Bethesda
- Agency: Miles & Stockbridge P.C.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/34

Abstract:
A self-contained fluid-cooled electro-optical plug in type module capable of being exchangeably mounted in an external chassis incorporates electronic or electro-optical devices mounted on one or more interposers which provide electrical power and electric and optical signal connections to the devices and are also provided with fluid conduits through which a cooling fluid is circulated in a closed-loop cooling path to a heat exchanger for transferring the heat generated in the devices to external heat disposal equipment in the mounting chassis.
Public/Granted literature
- US20120300402A1 FLUID-COOLED MODULE FOR INTEGRATED CIRCUIT DEVICES Public/Granted day:2012-11-29
Information query