Invention Grant
US08730675B2 Electronic device and method of radiating heat from electronic device
有权
从电子设备辐射热量的电子设备和方法
- Patent Title: Electronic device and method of radiating heat from electronic device
- Patent Title (中): 从电子设备辐射热量的电子设备和方法
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Application No.: US13404546Application Date: 2012-02-24
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Publication No.: US08730675B2Publication Date: 2014-05-20
- Inventor: Tatsuya Sano , Tetsuya Okuchi
- Applicant: Tatsuya Sano , Tetsuya Okuchi
- Applicant Address: JP Tokyo SE Lund
- Assignee: Sony Corporation,Sony Mobile Communications AB
- Current Assignee: Sony Corporation,Sony Mobile Communications AB
- Current Assignee Address: JP Tokyo SE Lund
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
An electronic device including a housing including a frame member exposed to an outer surface of the electronic device; a circuit substrate disposed within the housing on which a plurality of electronic components are disposed; and a heat-radiating member provided in contact with or in close proximity to the electronic components disposed on the circuit substrate, and in contact with the frame member.
Public/Granted literature
- US20130050953A1 ELECTRONIC DEVICE AND METHOD OF RADIATING HEAT FROM ELECTRONIC DEVICE Public/Granted day:2013-02-28
Information query
