Invention Grant
- Patent Title: Method and system for wafer registration
- Patent Title (中): 晶片注册方法及系统
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Application No.: US13083561Application Date: 2011-04-10
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Publication No.: US08731274B2Publication Date: 2014-05-20
- Inventor: Eldad Langmans , Shimon Koren
- Applicant: Eldad Langmans , Shimon Koren
- Applicant Address: IL Migdal Haemek
- Assignee: CamTek Ltd.
- Current Assignee: CamTek Ltd.
- Current Assignee Address: IL Migdal Haemek
- Agent Oren Reches
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
A method for wafer registration, the method may include: moving a wafer by an X-Y stage and acquiring wafer edge area images; and processing the wafer edge area images to locate an edge of the wafer. A system that includes a camera, an X-Y stage for moving a wafer; wherein the camera is arranged to acquire wafer edge area images; and a processor that is arranged to process the wafer edge area images to locate an edge of the wafer.
Public/Granted literature
- US20120195490A1 METHOD AND SYSTEM FOR WAFER REGISTRATION Public/Granted day:2012-08-02
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