Invention Grant
US08731274B2 Method and system for wafer registration 有权
晶片注册方法及系统

  • Patent Title: Method and system for wafer registration
  • Patent Title (中): 晶片注册方法及系统
  • Application No.: US13083561
    Application Date: 2011-04-10
  • Publication No.: US08731274B2
    Publication Date: 2014-05-20
  • Inventor: Eldad LangmansShimon Koren
  • Applicant: Eldad LangmansShimon Koren
  • Applicant Address: IL Migdal Haemek
  • Assignee: CamTek Ltd.
  • Current Assignee: CamTek Ltd.
  • Current Assignee Address: IL Migdal Haemek
  • Agent Oren Reches
  • Main IPC: G06K9/00
  • IPC: G06K9/00
Method and system for wafer registration
Abstract:
A method for wafer registration, the method may include: moving a wafer by an X-Y stage and acquiring wafer edge area images; and processing the wafer edge area images to locate an edge of the wafer. A system that includes a camera, an X-Y stage for moving a wafer; wherein the camera is arranged to acquire wafer edge area images; and a processor that is arranged to process the wafer edge area images to locate an edge of the wafer.
Public/Granted literature
Information query
Patent Agency Ranking
0/0