Invention Grant
- Patent Title: Waveguide integration on laser for alignment-tolerant assembly
- Patent Title (中): 激光器上的波导集成用于对准容限组装
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Application No.: US13536329Application Date: 2012-06-28
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Publication No.: US08731346B2Publication Date: 2014-05-20
- Inventor: Jia-Hung Tseng , Peter L. Chang , Miriam R. Reshotko , Ibrahim Ban , Mauro J. Kobrinsky , Brian Corbett , Roberto Pagano
- Applicant: Jia-Hung Tseng , Peter L. Chang , Miriam R. Reshotko , Ibrahim Ban , Mauro J. Kobrinsky , Brian Corbett , Roberto Pagano
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: G02B6/12
- IPC: G02B6/12

Abstract:
Embodiments of the present disclosure provide optical connection techniques and configurations. In one embodiment, an apparatus includes a substrate, a laser device formed on the substrate, the laser device including an active layer configured to emit light, and a mode-expander waveguide disposed on the substrate and butt-coupled with the active layer to receive and route the light to a waveguide formed on another substrate. Other embodiments may be described and/or claimed.
Public/Granted literature
- US20140003765A1 WAVEGUIDE INTEGRATION ON LASER FOR ALIGNMENT-TOLERANT ASSEMBLY Public/Granted day:2014-01-02
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