Invention Grant
- Patent Title: Array cable assemblies
- Patent Title (中): 阵列电缆组件
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Application No.: US13190722Application Date: 2011-07-26
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Publication No.: US08731354B2Publication Date: 2014-05-20
- Inventor: Boyd G. Brower , Diana Rodriguez , Tadeusz M. Tenderenda
- Applicant: Boyd G. Brower , Diana Rodriguez , Tadeusz M. Tenderenda
- Applicant Address: US NC Hickory
- Assignee: Corning Cable Systems LLC
- Current Assignee: Corning Cable Systems LLC
- Current Assignee Address: US NC Hickory
- Agent C. Keith Montgomery
- Main IPC: G02B6/44
- IPC: G02B6/44 ; G02B6/46
Abstract:
An array cable includes radius guides at a tap point of the cable to take up slack for loose fibers at the tap point. The tap point is enclosed in a flexible enclosure that allows the assembly to be pulled through constricted space such as air handling spaces.
Public/Granted literature
- US20120027361A1 ARRAY CABLE ASSEMBLIES Public/Granted day:2012-02-02
Information query
