Invention Grant
- Patent Title: Bipolar lead containing HV and LV signal capability
- Patent Title (中): 双极引线含有HV和LV信号能力
-
Application No.: US11764886Application Date: 2007-06-19
-
Publication No.: US08731669B2Publication Date: 2014-05-20
- Inventor: Jordon D. Honeck , Andrew J. Ries , Karel F. A. A. Smits
- Applicant: Jordon D. Honeck , Andrew J. Ries , Karel F. A. A. Smits
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Reed A. Duthler
- Main IPC: A61N1/05
- IPC: A61N1/05 ; A61N1/375

Abstract:
An implantable medical device system includes a medical electrical lead having a connector assembly and a connector bore for receiving the lead connector assembly. The lead includes a distal portion having a first outer diameter and a distal sealing member, an intermediate portion having a second outer diameter smaller than the first outer diameter, and a connector pin extending from the intermediate portion, the connector pin having an outer diameter corresponding to a DF-1 standard.
Public/Granted literature
- US20080319503A1 BIPOLAR LEAD CONTAINING HV AND LV SIGNAL CAPABILITY Public/Granted day:2008-12-25
Information query