Invention Grant
- Patent Title: Substrate receiving method and controller
- Patent Title (中): 基板接收方式和控制器
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Application No.: US12762426Application Date: 2010-04-19
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Publication No.: US08731698B2Publication Date: 2014-05-20
- Inventor: Shinobu Onodera , Masahiro Numakura
- Applicant: Shinobu Onodera , Masahiro Numakura
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2009-102106 20090420
- Main IPC: G06F17/00
- IPC: G06F17/00

Abstract:
A substrate receiving method in a substrate processing system includes: a processing process of transferring a plurality of unprocessed substrates accommodated in a first substrate storage container to a substrate processing chamber in sequence and performing a plasma process on the unprocessed substrates in the substrate processing chamber; a retreating process of retreating the plasma-processed substrates temporarily to a second substrate storage container by transferring the plasma-processed substrates to the second substrate storage container in sequence; a determining process of determining whether or not the last unprocessed substrate is unloaded from the first substrate storage container; and a re-accommodating process of transferring and re-accommodating the plurality of the processed substrates accommodated in the second substrate storage container into the first substrate storage container in sequence when a substrate decided as the last unprocessed substrate is unloaded in the determining process.
Public/Granted literature
- US20100268364A1 SUBSTRATE RECEIVING METHOD AND CONTROLLER Public/Granted day:2010-10-21
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