Invention Grant
- Patent Title: Advancing layer surface grid generation
- Patent Title (中): 推进层表面网格生成
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Application No.: US12730902Application Date: 2010-03-24
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Publication No.: US08731869B2Publication Date: 2014-05-20
- Inventor: Todd R. Michal , Chung-Jin Woan
- Applicant: Todd R. Michal , Chung-Jin Woan
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A method of generating a surface grid may include forming a layer curve along the surface, forming a plurality of points along the layer curve, and extending a tangent vector from each one of the most recently formed points. Additional points may be formed on the surface at a step distance from the most recently formed points. The additional points may be interconnected to form an additional layer curve. The additional points may be connected with the most recently formed points to form a layer of quadrilateral faces wherein each one of the faces is a column. The growth of a column may be terminated when an aspect ratio of the face in the column exceeds a predetermined value. The steps of extending tangent vectors, forming the additional points, and forming an additional layer curve may be repeated until each one of the columns is terminated.
Public/Granted literature
- US20110238384A1 ADVANCING LAYER SURFACE GRID GENERATION Public/Granted day:2011-09-29
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