Invention Grant
- Patent Title: Techniques for thermal modeling of data centers to improve energy efficiency
- Patent Title (中): 数据中心热建模技术,以提高能源效率
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Application No.: US13644234Application Date: 2012-10-03
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Publication No.: US08731883B2Publication Date: 2014-05-20
- Inventor: Hendrik F. Hamann , Madhusudan K. Iyengar , Theodore G. vanKessel
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Michael J. Chang, LLC
- Agent Vazken Alexanian
- Main IPC: G06G7/54
- IPC: G06G7/54 ; G06G7/48

Abstract:
Techniques for modeling a data center are provided. In one aspect, a method for modeling a data center is provided. The method comprises the following steps. Spatially dense three-dimensional thermal distribution and air flow measurements made in the data center using a mobile off-line surveying system are obtained. A temperature and air flow model for the data center is created using the spatially dense three-dimensional thermal distribution and air flow measurements. The temperature and air flow model is used to make thermal distribution and air flow predictions of the data center. The thermal distribution and air flow predictions are compared with the thermal distribution and air flow measurements made using the mobile off-line surveying system to produce a validated model for the data center.
Public/Granted literature
- US20130166258A1 Techniques for Thermal Modeling of Data Centers to Improve Energy Efficiency Public/Granted day:2013-06-27
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