Invention Grant
- Patent Title: Semiconductor integrated circuit
- Patent Title (中): 半导体集成电路
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Application No.: US13137349Application Date: 2011-08-08
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Publication No.: US08732493B2Publication Date: 2014-05-20
- Inventor: Hiroyuki Nakajima
- Applicant: Hiroyuki Nakajima
- Applicant Address: JP Kawasaki, Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki, Kanagawa
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2010-184090 20100819
- Main IPC: G06F1/00
- IPC: G06F1/00

Abstract:
In a semiconductor LSI that sequentially performs predetermined processing on data input successively, a host CPU, a plurality of sequencers, and a data engine are connected in a hierarchical manner with the host CPU at top and the data engine at bottom. Each sequencer includes a memory that stores a parameter for execution of the sequencer, a memory controller, a loop counter, a sequence controller, and an interface unit that handles transmission and reception of signals with an external unit of the sequencer. The interface units of the plurality of sequencers have the same specifications.
Public/Granted literature
- US20120047376A1 Semiconductor integrated circuit Public/Granted day:2012-02-23
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