Invention Grant
US08732644B1 Micro electro mechanical switch system and method for testing and configuring semiconductor functional circuits 有权
微电子机械开关系统及半导体功能电路测试与配置方法

  • Patent Title: Micro electro mechanical switch system and method for testing and configuring semiconductor functional circuits
  • Patent Title (中): 微电子机械开关系统及半导体功能电路测试与配置方法
  • Application No.: US10942169
    Application Date: 2004-09-15
  • Publication No.: US08732644B1
    Publication Date: 2014-05-20
  • Inventor: Michael B. Diamond
  • Applicant: Michael B. Diamond
  • Applicant Address: US CA Santa Clara
  • Assignee: Nvidia Corporation
  • Current Assignee: Nvidia Corporation
  • Current Assignee Address: US CA Santa Clara
  • Main IPC: G06F17/50
  • IPC: G06F17/50
Micro electro mechanical switch system and method for testing and configuring semiconductor functional circuits
Abstract:
The present invention systems and methods enable configuration of functional components in integrated circuits. A present invention system and method utilizes micro electro-mechanical switches included in pathways of an integrated circuit to flexibly change the operational characteristics of functional components in an integrated circuit die based upon a variety of factors including power conservation, manufacturing defects, compatibility characteristics, performance requirements, and system health (e.g., the number of components operating properly). The micro electro-mechanical switches are selectively opened and closed to permit and prevent electrical current flow to and from functional components. Opening the micro electro-mechanical switches also enables power conservation by facilitating isolation of a component and minimization of impacts associated with leakage currents.
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