Invention Grant
- Patent Title: Placement and routing cells on integrated circuit chips
- Patent Title (中): 集成电路芯片上的放置和布线单元
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Application No.: US12069206Application Date: 2008-02-07
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Publication No.: US08732645B2Publication Date: 2014-05-20
- Inventor: Roger P. Ang , Ken R. McElvain , Kenneth S. McElvain
- Applicant: Roger P. Ang , Ken R. McElvain , Kenneth S. McElvain
- Applicant Address: US CA Mountain View
- Assignee: Synopsys, Inc.
- Current Assignee: Synopsys, Inc.
- Current Assignee Address: US CA Mountain View
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Agent Judith A. Szepesi
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
Methods and apparatuses to place and route cells on integrated circuit chips along paths. In one aspect of the invention, methods to layout an integrated circuit are based on placing and routing cells along paths. In one embodiment, a method to layout an integrated circuit including: routing a wire to connect a first cell of the integrated circuit and a second cell of the integrated circuit; and placing a third cell of the integrated circuit after the wire is routed to connect the first cell and the second cell. In one example, the first, second and third cells are on a first path; and, the third cell is connected to one of the first and second cells on the first path by only one net. The first path is selected from a set of paths; and the first and second cells are placed before the wire is routed to connect the first cell and the second cell. Timing is analyzed using a route of the wire connecting the first cell and the second cell to select a second path from the set of paths before a cell is placed on the second path.
Public/Granted literature
- US20080201678A1 Method and apparatus for placement and routing cells on integrated circuit chips Public/Granted day:2008-08-21
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