Apparatus to dry milled silicon particles has solvent spray nozzles, solvent drainage, gas inlet, and gas exhaust. This drying can occur, for example, following an acid etch and a deionized water rinse. The drying apparatus is an enclosed system with a lid that contains a solvent feeding tube and exhaust ventilation. This enclosed system design creates an effective low temperature drying system in an inert atmosphere. The apparatus can handle a variety of different particle sizes, inhibits the growth of surface oxides on the particles by using lower temperatures, and allows reuse of solvent.