Invention Grant
- Patent Title: Linear impelled module damper
- Patent Title (中): 线性推动模块阻尼器
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Application No.: US12610652Application Date: 2009-11-02
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Publication No.: US08733519B2Publication Date: 2014-05-27
- Inventor: Jeffrey Scott Ryan
- Applicant: Jeffrey Scott Ryan
- Applicant Address: US NC Mooresville
- Assignee: JRI Development Group, LLC
- Current Assignee: JRI Development Group, LLC
- Current Assignee Address: US NC Mooresville
- Agency: Balser & Grell IP Law
- Agent Jeffrey C. Watson
- Main IPC: F16F9/34
- IPC: F16F9/34

Abstract:
A linear impelled module damper includes a hollow cylinder having an inner body, an outer body, and a channel between the inner and outer body. The hollow cylinder has a sealed first end and a sealed second end. A piston movable within the hollow cylinder divides the hollow cylinder into a compression chamber and a rebound chamber. The channel communicates with the rebound chamber through at least one hole in the rebound chamber. A compression extension cylinder is rigidly fixed to the hollow cylinder approximate to the sealed second end on one end, and having a compression mount attached to the other end. The compression extension cylinder including an air valve being adapted to allow a piston rod to move in and out of the compression extension cylinder. The piston rod including a rebound mount on one end and extending into the compression extension cylinder on the other.
Public/Granted literature
- US20100187059A1 LINEAR IMPELLED MODULE DAMPER Public/Granted day:2010-07-29
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