Invention Grant
- Patent Title: Electronic device with mounting apparatus
- Patent Title (中): 具有安装设备的电子设备
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Application No.: US13209458Application Date: 2011-08-15
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Publication No.: US08733716B2Publication Date: 2014-05-27
- Inventor: Bin Li , Guang-Yao Lee , Yi-Sheng Lin
- Applicant: Bin Li , Guang-Yao Lee , Yi-Sheng Lin
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201110083116 20110402
- Main IPC: A47B96/00
- IPC: A47B96/00 ; F16M11/16 ; A47G1/24 ; E05C1/08

Abstract:
An electronic device includes a main body, a mounting device, and a supporting device. The mounting device attaches to the main body, and includes a mounting member, a bracket, and a latch. The bracket is mounted to the mounting member; the latch includes a securing section, and is slidably mounted to the bracket. The supporting device includes a retaining tab to engage the securing section. The supporting device is to be removed from the mounting device when the latch slides on the bracket to detach the securing section from the retaining tab.
Public/Granted literature
- US20120250232A1 ELECTRONIC DEVICE WITH MOUNTING APPARATUS Public/Granted day:2012-10-04
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