Invention Grant
- Patent Title: Non-wetting coating on a fluid ejector
- Patent Title (中): 流体喷射器上的非润湿涂层
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Application No.: US13125474Application Date: 2009-10-27
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Publication No.: US08733897B2Publication Date: 2014-05-27
- Inventor: Yoshimasa Okamura
- Applicant: Yoshimasa Okamura
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Fish & Richardson P.C.
- International Application: PCT/US2009/062194 WO 20091027
- International Announcement: WO2010/051272 WO 20100506
- Main IPC: B41J2/135
- IPC: B41J2/135 ; B05D1/38

Abstract:
A fluid ejector includes a substrate having an exterior surface and an interior surface. A non-wetting coating can cover at least a portion of the exterior surface and can be substantially absent from the flow path. A non-wetting coating can be formed of a molecular aggregation. A precursor of a non-wetting coating may flow into a chamber at a higher temperature higher than the substrate. A non-wetting coating can be over a seed layer. An outer portion of the seed layer can have a higher concentration of water molecules or a greater density than an inner portion. The outer portion can be deposited at a ratio of partial pressure water to partial pressure matrix precursor that is higher than the ratio for the inner portion. An oxygen plasma can be applied to a seed layer on the exterior surface, and the non-wetting coating can be applied on the seed layer.
Public/Granted literature
- US20110261112A1 NON-WETTING COATING ON A FLUID EJECTOR Public/Granted day:2011-10-27
Information query
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