Invention Grant
US08734166B2 Printed wiring board and connector, and method for manufacturing printed wiring board
有权
印刷电路板和连接器,以及印刷电路板的制造方法
- Patent Title: Printed wiring board and connector, and method for manufacturing printed wiring board
- Patent Title (中): 印刷电路板和连接器,以及印刷电路板的制造方法
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Application No.: US13863818Application Date: 2013-04-16
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Publication No.: US08734166B2Publication Date: 2014-05-27
- Inventor: Tsutomu Nakayama , Kengo Ueda
- Applicant: Fujitsu Limited
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A printed wiring board includes a board body that includes a signal line embedded at a predetermined wiring position and a through hole electrically connected to the signal line, and a connector that includes a connector plate including a connection terminal electrically connected to the signal line via the through hole, and electrically connects the connection terminal to the signal line by insertion of the connection terminal of the connector plate into the through hole in a direction of one of a front surface and a rear surface of the board body according to a wiring position of the signal line so that a transmission path of the connection terminal on a stub side is shorter than a transmission path of the connection terminal on an input and output side.
Public/Granted literature
- US20130230992A1 PRINTED WIRING BOARD AND CONNECTOR, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD Public/Granted day:2013-09-05
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