An electrical connector for electrically connecting a chip module to a printed circuit board. The electrical connector includes an insulating body and a pressing plate for covering the insulating body. A receiving area for receiving the chip module is disposed on the insulating body. Multiple terminal receiving slots are provided inside the receiving area, and at least one bump is disposed inside the receiving area. An opening is provided at the pressing plate. An urging portion is disposed at each of two opposite sides of the opening, respectively, and pressing force-application points are formed at two ends of the urging portion. When the pressing plate covers the insulating body, the bump is correspondingly located below the force-application points to bear the chip module, so as to avoid warps and deformations of the chip module when pressed.