Invention Grant
- Patent Title: Polishing pad for chemical mechanical polishing process and chemical mechanical polishing apparatus including the same
- Patent Title (中): 用于化学机械抛光工艺的抛光垫和包括其的化学机械抛光装置
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Application No.: US13036496Application Date: 2011-02-28
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Publication No.: US08734206B2Publication Date: 2014-05-27
- Inventor: One-Moon Chang , Jae-Phil Boo , Soo-Young Tak , Jong-Sun Ahn , Shin Kim , Kyoung-Moon Kang
- Applicant: One-Moon Chang , Jae-Phil Boo , Soo-Young Tak , Jong-Sun Ahn , Shin Kim , Kyoung-Moon Kang
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2010-0019170 20100303
- Main IPC: B24B1/00
- IPC: B24B1/00
Abstract:
A chemical mechanical polishing apparatus includes a platen configured to support and rotate a wafer, and a polishing pad facing the platen. The polishing pad includes a body having a groove with a rotational symmetric pattern.
Public/Granted literature
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