Invention Grant
- Patent Title: Flattening method and flattening apparatus
- Patent Title (中): 扁平化方法和压平装置
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Application No.: US12285737Application Date: 2008-10-14
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Publication No.: US08734661B2Publication Date: 2014-05-27
- Inventor: Kazuto Yamauchi , Yasuhisa Sano , Hideyuki Hara , Junji Murata , Keita Yagi
- Applicant: Kazuto Yamauchi , Yasuhisa Sano , Hideyuki Hara , Junji Murata , Keita Yagi
- Applicant Address: JP Tokyo
- Assignee: Ebara Corporation
- Current Assignee: Ebara Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, LLP.
- Priority: JP2007-268134 20071015; JP2007-305607 20071127
- Main IPC: B44C1/22
- IPC: B44C1/22 ; C23F1/08

Abstract:
A flattening method, by utilizing the advantages of the CARE method and making up for the disadvantages, can perform removal processing of a surface of a workpiece at a sufficient processing rate and can provide a processed surface having enhanced flatness without leaving damage in the processed surface. A flattening method comprises at least two surface removal steps and at least two cleaning steps, the final surface removal step being a catalyst-referred etching step comprising immersing a workpiece in a processing solution containing at least one of hydrohalic acid, hydrogen peroxide water and ozone water, and bringing a surface of a catalyst platen into contact with or close proximity to a surface to be processed of the workpiece to process the surface, said catalyst platen having in a surface a catalyst selected from the group consisting of platinum, gold, a ceramic solid catalyst, a transition metal, glass, and an acidic or basic solid catalyst.
Public/Granted literature
- US20090095712A1 Flattening method and flattening apparatus Public/Granted day:2009-04-16
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