Invention Grant
US08734665B2 Slurry for chemical-mechanical polishing of copper and use thereof
有权
用于铜的化学机械抛光的浆料及其用途
- Patent Title: Slurry for chemical-mechanical polishing of copper and use thereof
- Patent Title (中): 用于铜的化学机械抛光的浆料及其用途
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Application No.: US13271494Application Date: 2011-10-12
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Publication No.: US08734665B2Publication Date: 2014-05-27
- Inventor: Graham M. Bates , Michael T. Brigham , Joseph K. Comeau , Jason P. Ritter , Eva A. Shah , Matthew T. Tiersch , Eric J. White
- Applicant: Graham M. Bates , Michael T. Brigham , Joseph K. Comeau , Jason P. Ritter , Eva A. Shah , Matthew T. Tiersch , Eric J. White
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Schmeiser, Olsen & Watts
- Agent Anthony Canale
- Main IPC: B44C1/22
- IPC: B44C1/22
Abstract:
A composition and a method for chemical mechanical polishing. The composition includes a surfactant anion an alkyl alcohol, a controlled amount of chloride ion source and a diluent. The composition further includes abrasive particles and an oxidizer. The method includes providing the composition on a surface to be polished and polishing the surface by contacting the surface with a polishing pad.
Public/Granted literature
- US20130092651A1 SLURRY FOR CHEMICAL-MECHANICAL POLISHING OF COPPER AND USE THEREOF Public/Granted day:2013-04-18
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