Invention Grant
- Patent Title: Carbon composite mold design
- Patent Title (中): 碳复合模具设计
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Application No.: US13566251Application Date: 2012-08-03
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Publication No.: US08734706B2Publication Date: 2014-05-27
- Inventor: Paul Choiniere , Glenn Aune , John Difonzo , Daniel Hong , Kevin Kenney
- Applicant: Paul Choiniere , Glenn Aune , John Difonzo , Daniel Hong , Kevin Kenney
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: B29C45/40
- IPC: B29C45/40

Abstract:
A mold assembly or system includes a moldbase that holds mold inserts and has embedded fluid lines to facilitate cooling during part formation. Mold inserts combine to form mold cavities that receive carbon fiber and resin components to form a carbon composite based part. A permanent release coating along a mold component surface that contacts the carbon fiber and resin components facilitates the release of the finished part from the mold component. Guide pins and guide pin receiving holes facilitate accurate alignment of mold components. Ejector pins within respective ejector pin shafts help eject a finished part from a respective mold component. An ejector pin shaft cover transfers force from an ejector pin to eject a finished part and also prevents substantial passage of resin into the ejector pin shaft. A fluid actuated ejection system provides fluid based mechanical forces to the ejector pins to facilitate finished part ejection.
Public/Granted literature
- US20120302670A1 CARBON COMPOSITE MOLD DESIGN Public/Granted day:2012-11-29
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