Invention Grant
US08734894B2 Self-aligned bevels for write poles 有权
用于写入极的自对准斜面

Self-aligned bevels for write poles
Abstract:
A method of depositing material onto a base portion of a wafer is disclosed. The method includes forming a bevel into a portion of a surface of the base portion of the wafer and depositing a first layer of conductive material onto the beveled portion of the base portion so that part of the first layer includes a wedge shape above the surface of the base portion. A second layer of conductive material is deposited onto the base portion including the portion of the base portion onto which the first layer of material is deposited.
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