Invention Grant
- Patent Title: Methods and apparatus for coating substrates
- Patent Title (中): 涂覆基材的方法和设备
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Application No.: US12721080Application Date: 2010-03-10
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Publication No.: US08734909B2Publication Date: 2014-05-27
- Inventor: Subramanian Easwaran Iyer , Jeremy Richard Lizotte , William Joseph Burgess , Wayne Scott Strasser , James Wilson Mercer, Jr. , Tony Wayne Helton , Gary Darrel Boone
- Applicant: Subramanian Easwaran Iyer , Jeremy Richard Lizotte , William Joseph Burgess , Wayne Scott Strasser , James Wilson Mercer, Jr. , Tony Wayne Helton , Gary Darrel Boone
- Applicant Address: US TN Kingsport
- Assignee: Eastman Chemical Company
- Current Assignee: Eastman Chemical Company
- Current Assignee Address: US TN Kingsport
- Agent Louis N. Moreno
- Main IPC: B29C47/02
- IPC: B29C47/02 ; B05C5/00 ; B05D7/06 ; B29C47/00 ; B29C47/08 ; B05C5/02

Abstract:
Methods and apparatus for coating substrates. A die can be employed for extrusion coating an elongated substrate, where the die defines a coating cavity therein. The die can comprise a die block having a coating supply channel for supplying a coating material to the coating cavity. The die can further comprise a guide plug and a die plate removably coupled to the die block. The guide plug can comprise a substrate inlet having a non-circular lateral cross-section, and the die plate can comprise a substrate outlet also having a non-circular lateral cross-section. A coating system comprising such a die can operate to coat a substrate where the substrate can be pushed at least partially through the die and contacts the coating material therein.
Public/Granted literature
- US20110223342A1 METHODS AND APPARATUS FOR COATING SUBSTRATES Public/Granted day:2011-09-15
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