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US08734938B2 Method of cutting out chips for a plurality of sensor elements from laminated body, method of manufacturing sensor element, and sensor element 有权
从层叠体切割多个传感器元件的芯片的方法，制造传感器元件的方法和传感器元件

Method of cutting out chips for a plurality of sensor elements from laminated body, method of manufacturing sensor element, and sensor element
Abstract:
A sensor element is formed by cutting a laminated body and heating with the cutting taking place in a state where a difference in resistance on sides of a cutting component is as small as possible. That is, a uniform cutting is where resistance added to both sides of the cutting component is substantially the same. When uniform cutting cannot be performed, a nonuniform cutting in a state where resistance added to both sides of the cutting component is different is performed. Consequently, a surface perpendicular to a longitudinal direction of the sensor element is trapezoidal.
Abstract(Chinese):

通过切割层叠体并且在切割部件的侧面上的电阻差尽可能小的状态下进行切割而形成传感器元件。 也就是说，均匀切割是在切割部件的两侧添加的电阻基本相同的。 当不能进行均匀切割时，执行在切割部件的两侧添加的电阻不同的状态下的不均匀切割。 因此，垂直于传感器元件的纵向方向的表面是梯形的。

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