Invention Grant
- Patent Title: Thermally reversible hot melt adhesive composition containing multifunctional diene and dienophile compounds
- Patent Title (中): 含有多官能二烯和亲二烯类化合物的热可逆热熔胶组合物
-
Application No.: US13323090Application Date: 2011-12-12
-
Publication No.: US08734939B2Publication Date: 2014-05-27
- Inventor: Donald Herr , Laxmisha M. Sridhar , Andrew Slark
- Applicant: Donald Herr , Laxmisha M. Sridhar , Andrew Slark
- Applicant Address: US CT Rocky Hill
- Assignee: Henkel US IP LLC
- Current Assignee: Henkel US IP LLC
- Current Assignee Address: US CT Rocky Hill
- Agent James E. Piotrowski
- Main IPC: A01K1/015
- IPC: A01K1/015 ; B32B27/36 ; B32B27/00 ; B32B27/34 ; B23B9/04 ; C08F290/14 ; C08F265/10 ; C08F267/10 ; C08F283/00 ; C08F26/06
Abstract:
The invention relates to a thermally reversible hot melt adhesive that is isocyanate-free, moisture independent, crosslinkable and thermally reversible. The thermally reversible hot melt adhesive may be repeatedly heated and cooled without negatively affecting the performance of the adhesive. The thermally reversible composition may also be used as a primer layer. The thermally reversible hot melt adhesive and primer are particularly well suited for end use applications such as packaging, graphic arts, construction, footwear, textiles, general assembly, automotive and consumer goods.
Public/Granted literature
Information query
